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application/pdfIEEEIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2013;32;11;10.1109/TCAD.2013.2270285Clock-skew reductionelectrical-thermal–mechanical couplingnonlinear MOSCAPstress gradienttemperature gradientthermal TSVthrough-silicon via (TSV)TSV stressReliable 3-D Clock-Tree Synthesis Considering Nonlinear Capacitive TSV Model With Electrical–Thermal–Mechanical CouplingManoj P. D. SaiHao YuYang ShangChuan Seng TanSung Kyu Lim
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems1734 Nov. 2013113210.1109/TCAD.2013.22702851747
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application/pdfIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2013;32;11;10.1109/TCAD.2013.2270285Reliable 3-D Clock-Tree Synthesis Considering Nonlinear Capacitive TSV Model With Electrical–Thermal–Mechanical Coupling
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2013-10-09T17:58:58.000Z2018-12-04T18:48:34.000ZDVIPSONE 2.2.2 http://www.YandY.com
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